$60M Investment: STMicroelectronics Advances Revolutionary Panel-Level Packaging for Next-Gen Chips in France
STMicroelectronics (NYSE:STM) has announced plans to develop next-generation Panel-Level Packaging (PLP) technology through a new pilot line at its Tours facility in France. The company is investing $60 million in this strategic initiative, which is expected to be operational by Q3 2026. The advanced PLP technology represents…