This billionaire dumped cloud stocks for these new AI stocks. Should investors do the same?

This billionaire dumped cloud stocks for these new AI stocks. Should investors do the same?
This billionaire dumped cloud stocks for these new AI stocks. Should investors do the same?

Billionaire portfolio manager Philippe Laffont of Coatue Management had a busy first quarter. The tech investor significantly reduced his fund’s holdings in the big three cloud providers Amazon, Alphabetand microsoftwhile completely abandoning his position in Oracle.

Meanwhile, it was buying a couple of semiconductor infrastructure enablers. Increased participation in Taiwan Semiconductor Manufacturing Co. (NYSE: TSM)which is its main holding, while adding a new position in ASML Holding (NASDAQ: ASML). The moves are interesting, as Laffont is shifting focus from companies that buy and use the technology to companies that facilitate it.

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I’m still a big fan of big cloud providers, with Amazon and Alphabet being two of my favorite stocks. Both have good cost advantages due to their chip businesses, while they also have strong and growing businesses outside their cloud divisions. Meanwhile, Microsoft’s software and cloud units are doing well and the stock appears undervalued for the opportunity ahead. As such, I certainly wouldn’t get rid of these stocks.

However, let’s focus on what may have attracted Laffont to TSMC and ASML.

Taiwan Semiconductor Manufacturing: The Foundry Leader

Making logic chips is not easy, which is why most semiconductor companies leave manufacturing to third-party foundries. That’s where Taiwan Semiconductor Manufacturing comes in. It is the largest foundry in the world and, thanks to its experience and scale, has a near monopoly on manufacturing advanced logic chips such as graphics processing units (GPUs).

While it has competitors in the space, what sets TSMC apart is its ability to produce advanced chips with high yields, meaning they have few defects. As nodes (chip density) have reduced, other foundries have generally had problems in this area. At the same time, the company is also a leader in advanced packaging, where it can place GPUs next to high-bandwidth memory (HBM) through its CoWos (Chip-on-Wafer-on-Substrate) technology.

With its ability to do all of this at scale, TSMC has become an invaluable part of the semiconductor value chain. This has also given the company strong pricing power, with reports that it has already informed customers of planned price increases for several years. It also helped generate strong margins for the company.

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